Welcome to Palomar Technologies

Thank you for visiting us on the web. We appreciate your interest in our company and our products, and encourage you to contact us. We welcome the opportunity to find a solution to your component packaging and assembly need.

With offices and technicians located around the world in North America, Europe and Asia, Palomar offers it's customers personal service and support, regardless of customers' factory location.

At Palomar, we focus on listening to our customers and continually innovating to meet your needs: 

• When component manufacturers needed increased flexibility, precision and accuracy, speed and versatility to handle a high mix/medium volume complex packages, we introduced the 3800 Ultra Flexible Die Bonder , Model 8000 Wire Bonder and the 1.5 micron 6500 Die Bonder.
• When start-ups were struggling with prototyping and how to design for manufacturing, we introduced our Process Development and Prototyping Services
• When demand for high thermal conductivity and lead free connections increased, we developed the planarBump™ option for the Model 8000 Wire Bonder, a process that uses gold instead of solder to produce bump arrays
• When customers needed low volume contract manufacturing services, Process Development and Prototyping Services evolved into Palomar Microelectronics, delivering high quality and high reliability turnkey products 

By concentrating on automating the most complex manufacturing processes, our products have the highest impact on your yield and manufacturing costs. If you are facing new and complex packaging challenges, need to get your newest product to market rapidly, or just want to improve your present processes, I invite you to contact the experts at Palomar by visiting our Microelectronic Solutions page and Blog or by Contacting Us.

Sincerely, 
Bruce W. Hueners, President & CEO
Palomar Technologies