Wire Bonding

Fine Pitch Au Wire Bonding

Application:  Fine pitch wire bonding for bonding high density die is measured in pitch.  This is a pitch that every year gets a little smaller.  The limiting factor on the Palomar Model 8000 is generally the capillary.  The model 8000 can bond with as little as 4 grams of force!  This high resolution control of bond parameters is what makes fine pitch wire bonding smaller each year.

The SEM photo shows wires bonded at 50 um pitch and the ball is only 30 um. 

Au Wire Bonding in place of Ribbon

Application:  Wire bonding RF devices with all ball bonds saves a machine transfer and setup time and possibly the purchase of another machine.  Some active tuning is also possible by removing wires after completion.  This picture shows 3 rows of transverse pitch gold wire bonds to replace a large ribbon bonding process.

Au Wire Bonding

Application:  Gold wire bonding describes what the Palomar Model 8000 was designed to do.  Deep Access in a package, long wires and varying part heights are just fine for bonding.

The picture shows a long wire 100 + mil bonding an output pin in a package.

Reverse Bond to Die Application:  Low profile reverse bond to a die.  Stand-off-stitch is used to place a ball bump on the die pad and then stitching onto t he ball bump.  A second ball bump is used on the pad as a fulcrum to keep the wire from sagging onto the die edge.
Loop Height 4 mil above die

Reverse Bond to Die Application:  Low profile reverse bond to a die.  Stand-off-stitch is used to place a ball bump on the die pad and then stitching onto the ball bump.
Loop Height 10 mil above die