Applications - Solving Your Packaging Challenge

By participating in a pre-quotation study with the customer, Palomar’s Applications Engineers help clarify and define the appropriate equipment or service needed. Once equipment selection is made and manufacture is complete, the Apps Engineer can demonstrate the chosen machine’s capabilities using a customer’s parts and programs (a buyoff per se).

Palomar provides solutions for a wide variety of application requirements for first level interconnect of microelectronic packages. Its fundamental capabilities for large area, high precision, and high performance assembly make Palomar a supplier of choice.

Process capabilities listed are the foundation of our business for equipment and contract assembly

Wafer Scale Packaging
Laser Diode Packaging
Optoelectronic Packaging
Wedge Bonding
Eutectic Die Bonding
Epoxy Die Bonding
High accuracy (10um and 1.5um) die attach using eutectic or adhesive bonding
Epoxy dispense
Gold stud bumping / Gold Ball Bumping
Hybrid / MCM wire bonding of complex and deep access packages
RF Device Packaging
Power Amplifiers Packaging
Power Transistor Packaging
Active Optical Cable Packaging (ultra high accuracy pick and place using VCSELS, Edge Emiting Lasers)
Inkjet Printhead Assembly
LED Prinhead Assembly
Form factor shrinking of package

These capabilities are applied to the Aerospace & Defense, Medical, Telecommunications, and Consumer high technology markets.

Check out our Blog that discusses these applications on an individual level.