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Sunday, May 11, 2008
Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, presents the latest version of its award-winning automatic die bonder, the Model 3500-III.
By Laurie @ 11:59 PM :: 1022 Views :: 0 Comments

Designed for fully automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area. Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules, and hybrid microcircuits.

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Sunday, May 11, 2008
Honored for Model 3500-II Automatic Component Placement Cell
By Laurie @ 11:56 PM :: 1212 Views :: 0 Comments
Carlsbad, Calif. –Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announces that it received the Editors’ Choice Best Product Award for its Model 3500-II Automatic Component Placement Cell. Presented annually by Semiconductor International magazine, the award honors products that are making a difference in semiconductor manufacturing.
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Sunday, May 11, 2008
Automated Hybrid Assembly Comes of Age
By Laurie @ 11:43 PM :: 796 Views :: 0 Comments
With the increased levels of complexity and spiraling costs in manufacturing, hybrid and MCM manufacturers are increasingly turning to the use of automated assembly lines to integrate several of the component placement, wire bonding and accessory steps.
The resultant improvements in yields, increased throughput, and reduced time to market have made automated assembly lines among the most strategic competitive weapons for reduction of total cost of ownership in the coming decade.
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Monday, February 18, 2008
Palomar Technologies Highlights New Features of Component Placement System at OFC Booth #3316
12:02 AM :: 1203 Views :: 0 Comments
Carlsbad, Calif. – February 18, 2008 – Palomar Technologies, provider of precision automation equipment, process development, and contract assembly services for microelectronics, will highlight the updated features of its Model 3500-III and the capabilities of its Model 6500 component placement systems at booth #3316 at OFC 2008. The conference will be held February 26 – 28, 2008 in San Diego, California.
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Tuesday, December 11, 2007
Palomar Technologies Partners with Vision Manufacturing, Inc. to add PWB and SMT Services for Palomar Microelectronics
By Laurie @ 12:07 AM :: 650 Views :: 0 Comments
Carlsbad, Calif. – December 11, 2007 – Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronics, announces a partnership with Vision Manufacturing, Inc. (VMI), of Vista, California. Through VMI, Palomar Microelectronics can offer printed wiring board (PWB) and surface mount technology (SMT) services for its customers to supplement the process development, prototyping, and low volume assembly services Palomar Microelectronics provides.
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