Technical Resources

All downloads are available in PDF. For addtional information or to set up a system and/or process demonstration, please contact us. We host application demonstrations every day of the week at our Carlsbad, CA campus.

Ebooks

Micron-Level Placement Accuracy for Optoelectronic Components

Micron-Level Placement Accuracy for Wafer Scale Packaging of P-Side Down Lasers in Optoelectronic Components

Wire Bonding an RF-SOE Package using a Gold Ball Bonder

Odd Form Factor Packaging

Published Articles

Automated Eutectic Die Attach

Wire Bond Technology - The Great Debate: Ball vs. Wedge

High Brightness Matrix LED Assembly Challenges and Solutions

Optoelectronics Packaging: Building upon Integrated Circuit Manufacturing Expertise

Making the Connection with Wire Bonding

Contract SMT and Microelectronics Assembly in One

Ball in Corner - The Latest in Suspension Interconnect Technology

Automated Hybrid Assembly

Geometry and Bond Improvement for Wire Ball Bonding and Bumping

Gold Ball Bumping: An Effective Wafer Bumping Method

Gold Bump Technologies Plating versus Ball

Contract Manufacturers make strides in Active Components

Automated Ribbon Bonding

Equipment for Advanced Packaging