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Truly a "universal" system perform bond shearing, die shearing, tweezer and ball pull and wire pull. Also, it is able to gather rich data and give the user export and analysis options in addition to multi-range test modules down to 1/10 of full scale. Highlights of this system are its high speed zone shear test of solder ball integrity and its stud pull capacity of up it 200kgf.
Supports destructive and non-destructive testing; compliant with Mil 883 test methods;
small clean-room footprint; data export via RS232 and printer port; reports test data with fail code, mean, standard deviation, Cpk, Cpl, Cpu; easy control of pull hook by computer mouse; optional “pantograph” style manipulator; built in illumination
Optional Non-Surface Contact operation; available for up to 300mm wafers; picks die as small as 150 μm square; Waffle Pak, Gel-Pak® and film frame output; underside, facet device inspection options; die inverter option; throughput of 500-1200 UPH, product, process dependant; quick change over, under 10 minutes
Low cost automatic die sort from wafer to tray or film frame; reads many wafer map formats; supports Multi-Project, Pizza Map, Reticle Mask wafers; picks 50 μm thick GaAs with air bridges and vias; picks large, fragile, complex geometry MEMS devices; optional inline die inverter; flexible die binning with tray pocket traceability; wafer input up to 300 mm, film frames or rings; quick change output fixtures, Gel-Pak, waffle pack, Jedec trays, film frames