Connectivity Benefits and Cost Advantages

Gold bumping also provides superior electrical connectivity, low inductance values, reduced electrical loss, and lower power requirements, making it attractive for those seeking to move away from gold wire bonding or solder interconnects.

Gold bumping can be less expensive than solder bumps in many applications. The cost benefit of gold versus solder primarily depends on how many bumps are on each wafer—when using wire to make gold ball bumps, you only pay for the number of bumps placed, so if your application requires less than 140,000 bumps, then it’s more cost effective to use gold.