planarBump™ Technology
This technology is based on our mature and proven wire bonding process, therefore the reliability of these bump connections is well established and understood. This feature is included in new Model 8000s and is available as an upgrade option on existing ones.
Co-planarity refers to the height consistency across the top of all bumps. Height variations can lead to uneven distribution of forces, die fractures, and open circuits—planarBump™ offers industry-best finished bond height consistency of 2 microns (with bump placement accuracy of ± 2.5 microns) and also produces a consistent top surface area on each bump, leading to ideal connectivity and attachment for flip chip applications.
The flexibility of planarBump™ allows for quick and easy changes to the ball bump array, position, and shape to best suit the application and desired attach process. The working platform accommodates small, batch, and high volume runs for all your R&D, prototyping, and manufacturing needs.