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Manual Bonders

Hybond systems include Thermosonic Ball and Wedge Wire Bonders, Single Point TAB Bonders, Epoxy and Silver-Glass Die Bonders, Eutectic and Laser Diode Die Bonders, DFS Universal Bonder Test Units and a variety of adjustable height heated work stages.

For specifications and detail on on the products listed below, Hybond's Data Sheets are available in PDF format for download by selecting any of the bolded product names.

Model 626 Multipurpose Digital Thermosonic Wire Bonder, Ball Bonder, Wedge Bonder, Bump or Stud Bonder, Peg Bonder and more

Model 676 Digital Thermosonic Wire Bonder and Ribbon Wedge Bonder - 0.5 to 3.0 mil diameter Wire and up to 1 x 12 mil Ribbon

Model 522A-40 Deep Access/Long Reach Thermosonic Ball Bonder - 0.7 to 2.0 mil Gold Wire

Model UDB-140B Eutectic/Thermoplastic Die Bonder

Model UDB 141 Eutectic/Thermoplastic Die Bonder

Model UDB-206A Manual Ultrasonic Eutectic Die Bonder

Model 572A-40 Deep Access/Long Reach Thermosonic Wire Bonder and Ribbon Bonder - 0.5 to 2.0 mil diameter wire and up to 1 x 10 mil ribbon

Model 572ADeep Access Thermosonic Wire Bonder and Ribbon Bonder - 0.5 to 2.0 mil diameter wire and up to 1 x 10 mil ribbon

Model 522A Thermosonic Ball Bonder - 0.7 to 2.0 mil Gold Wire

Model DFS-II Dynamic Force Measurement System - Measures force and time parameters on manual, semiautomatic and automatic wire bonders

Model EDB-140A Epoxy/Silver Glass Die Bonder