What is your objective in factory automation?
Do you need to build a million units per month?
The Inline Assembly Solution is preferable
Do you need flexibility to build a small combination
of products in medium volumes?
Islands of Automation may be preferable
Factory Automation applications include:
Hybrids (hybrid microelectronics devices)
MCMs (multi-chip modules)
Chip-on-Board (chip-attach to circuit board)
Chip-on-Flex (chip-attach to flex circuit)
GGI/Stud Bumping (Gold-Gold-Interconnect)
Wafer level packaging (chip-attach/interconnect to wafer)
Wafer bumping (Gold stud bump for GGI)
Wire Bonding (two-point and multi-point stitch)
Products include:
Sensors (automotive, military, industrial)
Controllers (computer, automotive, industrial)
Microwave Modules (RF transceiver, millimeter-wave radio)
Avionics (RF/IR, advanced landing radar
Munitions/Armament (guidance, RF, GPS, LASER, Gyro, Accelerometer)
Satellite Electronics (datalink, control)
RFID (radio frequency identification, asset location and tracking)
Scientific Instrumentation (RF/IR detectors, emitters)
Medical Devices (hearing aids, implantable pacemakers)
Medical Monitoring Devices (blood glucose, heart rate, blood pressure)
Wireless Telecommunications (RF power amplifiers, SAW filters)
Optoelectronics (TOSA/ROSA, optical amplifiers)
Palomar Technologies can provide factory automation in two ways:
Islands of Automation – individual processes such as component-attach or wire bond are performed within independent automated work cells; the packages are fed automatically through the work cells via a system of process carriers (boats) and magazines. The value of islands of automation is intended to be realized through greater production flexibility and faster product changeover.
Pros:
- Process operations such as die-bond and wire-bond run independently of the whole production line.
- Enables greater product changeover flexibility.
- In-line buffers are not required.
- In-line buffers are not required.
- Requires less integration time and effort than an inline system.
Cons:
- Line throughput is dependent upon scheduling separate operations.
- May require more labor to support independent work cells.
- Requires more input and output process carriers and handlers.
In-Line Assembly Systems - Packages are fed automatically through the production line via a system of process carriers and magazines in the same way islands of automation are – however, the production line may require buffers to balance throughput and the production rate is fixed at the rate of the slowest process in the line.
The value of an inline system is intended to be realized through high-volume, low-mix assembly of a single type of product with minimal or no product changeover and greater yield due to reduced operator contact with the product and materials.
Pros:
- May require less labor to operate than islands of automation.
- Line throughput is not dependent upon scheduling separate operations.
- Process operations such as die-bond and wire-bond run together as a whole production line.
- Fixed production rate allows for more accurate production planning, and potentially higher throughput.
Cons:
- Reduces product changeover flexibility.
- In-line buffers are frequently required to balance slow and fast operations which can add cost.
- Requires more up-front integration engineering time and effort than islands of automation.