Model 6500 Wafer Scale Packaging Eutectic Die Bonder

Palomar's Model 6500 Wafer Scale Packaging (WSP) Eutectic Die Bonder

Palomar's Model 6500 Wafer Scale Packaging (WSP) Eutectic Die Attach System was created to provide our customers’ a complete microelectronic solution for P-Side Down Laser Diode Attachment (Die to Wafer), Pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, Wafer Stage with steady state heating, and Waffle or Gel Pack presentation of Laser Diode applications.

The Model 6500 Wafer Scale Packaging Eutectic Die Bonder was designed specifically for fully automatic, high speed, precision P-Side Down Laser Die to Wafer Eutectic Assembly.

Features of the Model 6500 Wafer Scale Packaging Eutectic Die Bonder include:

Post-Process accuracies of 3 micron, 3 sigma for the front laser edge and strip position

Integrated lookup camera with laser stripe and laser edge alignment algorithm

Ultra-high accuracy eutectic cycle times less than 35 seconds including the in-situ heat and cool cycle for each laser diode

Single pulsed heat tool optimized for specific die size and desired heat profile

Palomar’s latest generation integrated pulsed heat profile controller with programmable profiles and performance tracking

Automatic wafer and laser diode loading (optional)

Die Bonder Speed, Accuracy and Compact Footprint

Answering the need for the combined speed, accuracy and compact footprint, the Model 6500 WSP Eutectic Die Bonder is an unmatched case for yielded throughput and cost of ownership in high accuracy assembly. An advanced Cognex pattern recognition system uses the lookdown camera to locate the wafer substrate locations and Laser N-side, and enables multiple alignment algorithms including area, point, and edge alignment. This system includes auto focusing with programmable on- and off-axis lighting systems to maximize contrast and accuracy in component placement.

Operating in a true Microsoft Windows Pro-based environment, the Model 6500 Wafer Scale Packaging Eutectic Die Bonder brings unparalleled software flexibility, power, and ease of use to precision hybrid component assembly. The user-friendly interface assists in bonding setup, operation, diagnostics, and calibration.