Die Bonders / Automated Component Placement Systems
Palomar Technologies manufactures, customizes and supports the most complete solution in it’s Die Bonders / Automated Component Placement Systems embodied in a Component Placement Work Cell.
Do you need equipment flexibility and multi-purposing?
Automated Component Placement Systems / Die Bonder can achieve this.
Do you want to take advantage of cutting edge technology that allows you to do more with less?
Automated Component Placement Systems / Die Bonders are the technology you need.
In today’s environment to remain relevant, efficient, innovative and cost-effective, a complete solution is the answer. The solution to your packaging and assembly needs is an Automated Component Placement System / Die Bonder that includes a manufacturable process.
Palomar's Model 3500-III is designed for fully automatic, precision microelectronics assembly. The highly flexible, computer-controlled work-cell performs up to three channels of adhesive dispense, component placement, eutectic die attach, and flip chip operations over a spacious 710-in2 work area. The Model 3500-III is versatile, powerful and can provide specialized functions in addition to its primary functions
Highlight Features of the Model 3500-III Die Bonder include a Large Work Area, Various Presentation Tools, Steady State and Pulse Heating Eutectic Bonding, High Accuracy Motion System, Multiple Dispense Technologies, Die Ejectors and Cognex Vision System
Applications – Model 3500-III Die Bonder
Component placement applications include AuSi eutectic scrub, AuSn eutectic solder attach , PbSn solder perform, Anisotropic Conductive Paste (ACP) for flip chip attachment, and High accuracy placement of optical components.
The Model 6500 Precision Eutectic Die Bonder is designed for high speed, fully automatic precision component assembly and offers micron-level placement accuracy for photonic, wireless, and medical applications. This Precision Eutectic Die Bonder is designed for fully automatic precision component assembly with 1.5µm placement accuracy (application dependent), making component assembly practical and cost effective.
A specialized configuration of the Model 6500 for Wafer Scale Packaging Eutectic Die Bonding has recently been made available.
Highlight Features of the Model 6500 are a 6-position bi-directional tool turret—for rapid tool changes on the fly, air bearing table—for positional accuracy over the entire work area, automated eutectic die assembly—for high volume, ultra high accuracy component placement, bond Data Miner™ (BDM) and RAM statistics—provides part traceability, predictive process capability and monitors machine fitness, linear encoder & high speed linear motors—increased accuracy and throughput, large work area (12”W x 6”D)—accommodates both large and small microcircuit substrates and packages, precision eutectic control—to apply heat at the temperature and length of time required for the application.
- Flip-chip on glass
- High frequency RF modules
- Laser Diode Packaging
- LED arrays
- Micro-Electrical-Mechanical components (MEMs)
- Ultra-fine pitch hybrids
- VCSEL modules
Component placement applications include AuSi eutectic scrub, AuSn eutectic solder attach, PbSn perform, high accuracy placement of optical components, high precision component attach using Ag epoxy.
Daubing on the Model 6500
Palomar's Model 6500 can perform daub die attach when the application requires it, with one or more daubing stations that are individually controlled. The automated daub tool is dipped into the daub pot, which contains the epoxy, and then touched to the die surface, resulting in dot transfer. These transferred dots can be as small as 5-8 mils—in actuality, dots larger than 15 mils are difficult to obtain. Low volume requirements and small dot size are the primary reasons to use daubing.
Model 6500's Equipment Options
Options include equipment for fully automatic substrate handling and special application requirements, such as:
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Custom tooling—assures a perfect bond because each application is different
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Fully automated substrate and part loading—results in higher throughput and yields
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Pulse/steady state heat stage—a feature unique to Palomar that provides the ability to apply precisely controlled heat to the application
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Software—productivity enhancing tools, like offline programming, wafer mapping, look-up camera referencing, and accuracy check (post-placement verification), can be added during build or as need arises
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Waffle and gel-pack stages—an efficient way of presenting die to the bonder