The Model 8000 Wire Bonder is a fully automated thermosonic high speed ball-and-stitch wire bonder and is the assembly method of choice for first level interconnection. Key features includeadaptive bond deformation, enhanced loop mode, tailless ball bumping, and wedge emulation (chain bonding).
When ball bumping is the preferred method of die attach, such as for flip chip applications, the Model 8000 Ball Bumper is the ideal choice. This fully automated bonder uses our patented advanced packaging planarBump™ technology to create the first ever co-planar bumps in a single step process. The flexibility of planarBump™ allows for quick and easy changes to the ball bump array, position, and shape to best suit the application and desired attach process.
As a Palomar Alliance, GPD offers state-of-the-art precision fluid dispensing systems designed for low-volume, high-mix, R&D, and high-volume 24/7 production. Applications include MicroVolume dots and lines, Underfills, Encapsulations, Lens Fixing, and Masks
A Palomar Alliance product, Hybond systems include Thermosonic Ball and Wedge Wire Bonders, Single Point TAB Bonders, Epoxy and Silver-Glass Die Bonders, Eutectic and Laser Diode Die Bonders, DFS Universal Bonder Test Units and a variety of adjustable height heated work stages