The Model 8000 Wire Bonder is a fully automated thermosonic high speed ball-and-stitch wire bonder and is the assembly method of choice for first level interconnection. Key features include adaptive bond deformation, enhanced loop mode, tailless ball bumping, and wedge emulation (chain bonding).
When ball bumping is the preferred method of die attach, such as for flip chip applications, the Model 8000 Ball Bumper is the ideal choice. This fully automated bonder uses our patented advanced packaging planarBump™ technology to create the first ever co-planar bumps in a single step process. The flexibility of planarBump™ allows for quick and easy changes to the ball bump array, position, and shape to best suit the application and desired attach process.
The Model 2470-V Wedge Bonder performs low-profile (fine pitch) interconnects and is also well suited for running stitch interconnects, reverse bonding, and ribbon bonding. It performs high speed, fine pitch automatic gold and aluminum wedge bonding, and gold ribbon bonding.
The Model 3470-II Wedge Bonder performs low-profile (fine pitch) interconnects and is also well suited for running stitch interconnects, reverse bonding, and ribbon bonding. It has the largest available bonding envelope and offers exceptional control and repeatability for challenging and complex applications.