Model 3500-III Die Bonder

The Model 3500-III Die Bonder and Component Placement System is designed for fully automatic, precision microelectronics assembly and performs adhesive dispense, pick and place component placement, eutectic die attach, and flip chip operations. This versatile machine is well suited for a high mix, low volume production environment, and can easily be configured for high volume production by adding automated handling capabilities. 

Model 6500 WSP Eutectic Die Bonder

The Model 6500 Wafer Scale Packaging (WSP) Eutectic Die Bonder combines speed, accuracy, and complact footprint. It's larger work area is configured specifically for P-side Down Laser Diode to Wafer pulsed reflow attach using advanced P-side referencing alogorithms using the integrated lookup camera.

Model 6500 High Precision Die Bonder

The Model 6500 Due Bonder  and Precision Component Placement System is designed for high speed, fully automatic precision component assembly and offers micron-level placement accuracy for photonic, wireless, and medical applications.

Royce Instruments - Bond Testing and Die Sorting

A Palomar Alliance, Royce provides bond testing systems can handle a variety of testing applications including wire bond loop pull testing, wire bond ball shear testing, BGA ball shear and pull testing, die bond shear testing, high speed ball shear testing and precision die sorting.

 

 

Model 8000 Wire Bonder

The Model 8000 Wire Bonder is a fully automated thermosonic high speed ball-and-stitch wire bonder and is the assembly method of choice for first level interconnection. Key features includeadaptive bond deformation, enhanced loop mode, tailless ball bumping, and wedge emulation (chain bonding). 

Model 8000 Ball Bumper

When ball bumping is the preferred method of die attach, such as for flip chip applications, the Model 8000 Ball Bumper is the ideal choice. This fully automated bonder uses our patented advanced packaging planarBump™ technology to create the first ever co-planar bumps in a single step process. The flexibility of planarBump™ allows for quick and easy changes to the ball bump array, position, and shape to best suit the application and desired attach process.

GPD Global - Precision Fluid Dispensing

As a Palomar Alliance, GPD offers state-of-the-art precision fluid dispensing systems designed for low-volume, high-mix, R&D, and high-volume 24/7 production. Applications include MicroVolume dots and lines, Underfills, Encapsulations, Lens Fixing, and Masks

Hybond - Manual Bonders

A Palomar Alliance product, Hybond systems include Thermosonic Ball and Wedge Wire Bonders, Single Point TAB Bonders, Epoxy and Silver-Glass Die Bonders, Eutectic and Laser Diode Die Bonders, DFS Universal Bonder Test Units and a variety of adjustable height heated work stages

 

 

Refurbished & Used Systems

Refurbished or used wire bonders, die bonders, wedge bonders and automated component placement systems and parts can be economical alternatives for many customers.  Palomar’s factory refurbished wire bonders and die bonders undergo a high-quality restoration.  They are completely burned in and tested to the same exacting standards that we apply to our new equipment.  Refurbished wire bonders and die bonders are fully warranted and can be supported by our extended factory service contract offerings.

Palomar Microelectronics

Our experience with design, engineering, prototyping, assembly, automation, and metrology means that we can take you from concept to production, and beyond. We apply ideas and solutions based on years of packaging experience to develop and validate your process before you invest in production equipment. And if you don’t want to run your own production, we can do that for you too by offering turnkey services for advanced packaging assembly. 

Integrated Production Line Services

We use our manual and automated process flow expertise to offer complete solutions to your assembly need, including full program management, systems integration, and automation.