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• Ball (Stud) Bumping
• Wire Bonding
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  • Epoxy Die Attach
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• Model 8000 Wire Bonder
• Model 8000 Ball (Stud) Bumper
• Component Placement Work Cells
  • Model 3500-III
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• Model 2470-V & Model 3470-II Wedge Bonders
• Integrated Production Line Services
• Palomar Microelectronics

• Warranty and Extended Service Contracts
• Model 3500 Upgrade
• Model 8000 Upgrade

• Datasheets
  • Model 8000 Wire Bonder & Ball (Stud) Bumper, PDF (188 kB)
  • Model 3500-III Component Placement Work Cell, PDF (141 kB)
  • Model 6500 Precision Component Placement Work Cell, PDF (130 kB)
  • Model 2470-V Wedge Bonder, PDF (xx kB)
  • Model 3470-II Wedge Bonder, PDF (xx kB)
  • Palomar Microelectronics, PDF (xx kB)
• Press Archive
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We would be happy to evaluate your process application need and propose a solution. Please call us at (760) 931-3600 or send an email to info@bonders.com.