PALOMAR MICROELECTRONICS
Through our process development, prototyping, and contract assembly services, now known as Palomar Microelectronics, Palomar Technologies has responded to the economic realities of modern advanced packaging (with its high equipment and labor costs), and the need for process development and low volume production on a limited scale. Our ability to offer high-value-added assembly services to our advanced packaging customers is just another facet of our mission to provide cost effective and system efficient solutions for your component assembly needs. Learn more about our services and how to get started with this PDF datasheet (75 kB). Download the Adobe PDF Reader free.
The Rise of Palomar Microelectronics
Over the past year, we’ve seen an increase in customer need for prototyping and low volume contract manufacturing services. Customers needed these services during a period when their own equipment was being procured and/or qualified. In response to this new demand, Palomar assigned clean room space, equipment, and highly skilled technical personnel to support assembly, quality, and test capabilities. We have also developed relationships with manufacturing partners to support surface mount, wafer saw, and component handling (e.g., Gel Pak and wafer packaging). We have developed key capabilities and demonstrated the ability to deliver high quality and high reliability turnkey products. Fred Engstrom, a 3M Program Manager and key customer, wrote, “The Palomar team has built the most amazing LED arrays that we had ever seen or even imagined. This team has demonstrated amazing responsiveness and incredible capabilities.”
Key Capabilities
Our experience with design, engineering, prototyping, assembly, automation, and metrology means that we can take you from concept to production, and beyond. Our advanced packaging assembly services include:
- Advanced wire bonding
- Eutectic component bonding
- Gold ball (stud) bumping
- Very high precision component placement
We apply ideas and solutions based on years of packaging experience to develop and validate your process before you invest in production equipment.
Our standard process development and prototyping services include:
- Ball bumping
- Component placement
- Metrology
- Package design and analysis
- Package sealing
- Pilot builds
- SMT
- Wire bonding
Palomar Microelectronics works hand in hand with Integrated Production Line Services (IPLS) to provide a complete solution to your process flow need. While we provide process recipe and prototyping expertise, IPLS provides manual and automated process flow expertise. If you’re interested in implementing your own production, then IPLS can help you do it.
Applications
We can help you with your microelectronics assembly needs, such as:
- Direct chip attach
- Flip chip
- High bright/high power LEDs
- Hybrids
- Implantable devices
- MEMs/MOEMs
- Optical devices
- RF amplifiers
- Solar cell assembly
- Stacked die
- Thermosonic/ thermocompression attach
Let Us Help You
We would be happy to evaluate your packaging and component assembly needs and develop an interconnect solution. Please call us at (760) 931-3600 or send an email to info@bonders.com.