THE MODEL 8000 WIRE BONDER
The Model 8000 Wire Bonder is a fully automated thermosonic high-speed ball-and-stitch wire bonder. As the assembly method of choice for first level interconnection, it’s suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high reliability devices. The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, also makes the Model 8000 suitable for flip chip and other advanced packaging applications. The overall precision of the Model 8000 Wire Bonder, along with its large work area and its available deep access capability, result in high yield processing of fine pitch/high wire count applications. Learn more about the Model 8000 Wire Bonder with this PDF datasheet (188 kB). Download the Adobe PDF Reader free.
Applications
Typical applications include:
- Automotive assemblies
- Chip on board (COB)
- Disk drive assemblies
- Fine pitch devices
- Flex circuits
- High bright/high power LEDs
- Large complex hybrids
- Multichip modules (MCMs)
- Multi-tiered ICs
- Specialty lead frames
- Stacked die
- System in packages (SIPs)
Key abilities include:
- Adaptive bond deformation—for ultimate control over ball and stitch deformation to improve overall bond consistency by reducing variation of loop size and shape
- Enhanced loop mode—provides exceptional long low loop capability, with loops up to 10mm
- Traditional wire bonding—from small wire count devices up to large packages with thousands of wires
- Chain Bonding—an alternative to traditional wedge bonding that combines the benefit of Au wire wedge bonding, and the speed, robustness, and other capabilities of a wire bonder
Application Options
The Model 8000 Wire Bonder is an extremely versatile piece of equipment and is the basis of several platforms that can provide specialized functions in addition to traditional applications:
Adaptive Bond Deformation™ (ABD)
More compact designs require finer pitch and lower profiles, which in turn require better control over ball and stitch geometry. Our patented Adaptive Bond Deformation™ technology allows direct and uniform control of ball and stitch deformation, which increases reliability, reduces process development and bond cycle time, and maximizes yields.
Die-to-Die Bonding
The primary benefit of die-to-die bonding is improved performance, higher density, and lower power consumption in mixed signal applications. The Model 8000 can perform IC to IC (die-to-die) interconnection without contacting the bond surface with the use of a security (safety) bond or a stand-off-stitch (SOS). The stand-off-stitch is key to die-to-die interconnection.
Reverse Bonding
The primary benefit of reverse bonding is the ability to form very low height loops for many applications. The Model 8000 can perform substrate to IC (reverse bonding) interconnection without contacting the bond surface with the use of a security (safety) bond or using a stand-off-stitch (SOS).
Tape Automated Bonding (TAB)
Suited for flat panel display, optical, implantable medical devices, and MCMs applications, the main advantage of TAB is the ability to test devices prior to final packaging, accommodating high-density circuits for high pin count devices.
Chain Bonding
Chain bonding is an alternative method to traditional wedge bonding that uses very precise looping algorithms in a stitch-stitch chain.
Features
The Model 8000 Wire Bonder offers:
- Fully automated assembly—results in extremely high yields and repeatable, predictable electrical performance
- Compact footprint—designed for efficient clean room layout (at less than 1 meter sq), it works as a standalone or integrated into a complete SMEMA compatible production line
- Deep access capability—enables wire bonding into packages as deep as 0.750”
- Large bonding area (12”W x 6”D)—accommodates very large packages and wafers, minimizes index time, and improves throughput
- Software—Bond Data Miner™ (BDM) provides part traceability, predictive process capability, and monitors machine fitness
Equipment Options
Model 8000 Wire Bonder options include equipment for fully automatic substrate handling and special application requirements, such as:
- Push-pull handlers—semi-automatic substrate handling
- Modular and edged-belt conveyors—fully automatic substrate handling
- Software—productivity enhancing tools, like offline programming, SPC tools, and wafer mapping, can be added during build or as need arises
- Custom tooling—Palomar will entertain all customer requests to support complex tooling solutions to address unique package geometries
Let Us Help You
We would be happy to evaluate your packaging and component assembly needs and develop an interconnect solution. Please call us at (760) 931-3600 or send an email to info@bonders.com.