PALOMAR TECHNOLOGIES WEDGE BONDERS
Wedge bonding is the prime solution for performing low profile (fine pitch) interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding. The Model 2470-V Wedge Bonder provides proven, consistent performance and ease of use. The Model 3470-II Wedge Bonder has the largest available bonding envelope and offers exceptional control and repeatability for challenging and complex applications. Learn more about the Model 2470-V and Model 3470-II wedge bonders with this PDF datasheet (83 kB). Download the Adobe PDF Reader free.
Applications
Wire interconnect bond pitches continue to decrease as package densities increase, features shrink, and I/O demand increases—the wedge bonder tool design allows wires to be bonded in close proximity, side by side to one another. Typical applications include:
- Advanced LED designs
- Compact hybrids
- Fine pitch devices
- High frequency passive and active components
- MCM power connections
- Microstrip transmission lines
- Microwave devices/tuning • RF packaging
- Wave guides
Key abilities include:
- Aluminum wedge bonding—for ultrasonic bonding of Al wire at room temperature
- Deep access bonding—for wire placement into deep electronic packages
- Die-to-die bonding—for improved performance, higher density, and lower power consumption in mixed signal applications
- Reverse bonding—for designs with low-profile looping requirements
- Ribbon bonding—for high power and high frequency packages
Model 2470-V Wedge Bonder
The Model 2470-V Wedge Bonder provides high speed, fine pitch, automatic gold and aluminum wedge bonding, and gold ribbon bonding. Ribbon bonding is a robust process that is gentle on bonding pads, and ribbon wire bonds can carry higher current while minimizing impedance and inductance. New machines are built to order and factory refurbished equipment is available.
- Large bonding area (12”W x 5”D)
- 0.400” bonding depth, standard; optional deeper access (0.850”) available
- Gold and aluminum wire, and gold ribbon
- Accommodates both very large and small microcircuit substrates and packages
- Consistent loop profiles and precise loop and wire control, from 0.7mil dia wire to 1x10mil ribbon
- Ultrasonic or thermosonic wedge bonding with optional heated work stage
Model 3470-II Wedge Bonder
The Model 3470-II Deep Access Wedge Bonder provides exceptional accuracy, control, and repeatability for bonding large complex parts. These machines are manufactured according to customer specifications.
- Extra large bonding area (32.5”W x 19.5”D)
- 0.400” bonding depth, standard; optional deeper access (0.850”) available
- Gold and aluminum wire, and gold ribbon
- Accommodates both very large and small microcircuit substrates and packages
- Consistent loop profiles, and precise loop and wire control, from 1mil dia wire to 1x10mil ribbon
- Ultrasonic or thermosonic wedge bonding with optional heated work stage
Let Us Help You
We would be happy to evaluate your packaging and component assembly needs and develop an interconnect solution. Please call us at (760) 931-3600 or send an email to info@bonders.com.