Model 6500

MODEL 6500 COMPONENT PLACEMENT WORK CELL

As a Component Placement Work Cell (CPWC), the Model 6500 Precision Die Bonder is designed for fully automatic precision component assembly with 1.5µm placement accuracy (application dependent), making component assembly practical and cost effective. Learn more about the Model 6500 with this PDF datasheet (130 kB). Download the Adobe PDF Reader free.

Applications

The Model 6500 CPWC offers micron-level placement accuracy (application dependent) for applications, such as:

Flip-chip on glass
High frequency RF modules
Laser diodes
LED arrays
Micro-Electrical-Mechanical components (MEMs)
Ultra-fine pitch hybrids
VCSEL modules

Component placement applications include:

AuSi eutectic scrub
AuSn eutectic solder attach
PbSn preform
High accuracy placement of optical components
High precision component attach using Ag epoxy

Application Options

The Model 6500 CPWC is an extremely versatile piece of equipment and can provide specialized functions in addition to its primary functions:

Flip Chip Assembly

The Model 6500 CPWC can perform flip chip assembly for a large range of chip sizes and applications, including epoxy and eutectic die attach. It can perform flip, dip, and lookup camera alignment in any combination, in any sequence, and also out of sequence (such as for solder or epoxy applications that require an intermediate step, such as an epoxy dispense or daub).

Eutectic Die Attach

Automatic eutectic attach techniques are particularly suited for high-performance and high-capacity die attach applications, such as optoelectronic components and high-power communication devices. Our ultra high accuracy pulse heat stage has been specially designed for the Model 6500 CPWC to allow controlled reflow, resulting in a stronger bond with minimum voiding. We can also implement a steady state heat stage if the application requires it, which is more typical for Au-Au interconnections or AuSi eutectic scrubbing applications.

Daubing

The Model 6500 CPWC can perform daub die attach when the application requires it, with one or more daubing stations that are individually controlled. The automated daub tool is dipped into the daub pot, which contains the epoxy, and then touched to the die surface, resulting in dot transfer. These transferred dots can be as small as 5-8 mils—in actuality, dots larger than 15 mils are difficult to obtain. Low volume requirements and small dot size are the primary reasons to use daubing.

Features

The Model 6500 CPWC offers:

6-position bi-directional tool turret—for rapid tool changes on the fly
Air bearing table—for positional accuracy over the entire work area
Automated eutectic die assembly—for high volume, ultra high accuracy component placement
Bond Data Miner™ (BDM) and RAM statistics—provides part traceability, predictive process capability, and monitors machine fitness
Linear encoder & high speed linear motors—increased accuracy and throughput
Large work area (12”W x 6”D)—accommodates both large and small microcircuit substrates and packages
Precision eutectic control—to apply heat at the temperature and length of time required for the application

Equipment Options

Model 6500 CPWC options include equipment for fully automatic substrate handling and special application requirements, such as:

Custom tooling—assures a perfect bond because each application is different
Fully automated substrate and part loading—results in higher throughput and yields
Pulse/steady state heat stage—a feature unique to Palomar that provides the ability to apply precisely controlled heat to the application
Software—productivity enhancing tools, like offline programming, wafer mapping, look-up camera referencing, and accuracy check (post-placement verification), can be added during build or as need arises
Waffle and gel-pack stages—an efficient way of presenting die to the bonder

Let Us Help You

We would be happy to evaluate your component assembly need and propose a solution. Please call us at (760) 931-3600 or send an email to info@bonders.com