Model 3500-III

MODEL 3500-III COMPONENT PLACEMENT WORK CELL

As a Component Placement Work Cell (CPWC), the Model 3500-III performs adhesive dispense, pick-and-place component placement, eutectic die attach, flip chip operations, and hybrid component assembly. It is designed for fully automatic, microelectronic assembly with 10µm typical placement accuracy (5µm under certain conditions). The Model 3500-III CPWC is a standalone system that is well suited for a high mix, low volume production environment, and can easily be integrated for high volume production by adding automated handling capabilities. It brings versatility, power, and ease of use to microelectronics assembly. Learn more about the Model 3500-III with this PDF datasheet (141 kB). Download the Adobe PDF Reader free.

Applications

The Model 3500-III CPWC provides high accuracy component placement and automatic die attach for a variety of assembly applications, especially for precise automated assembly of high performance components, including:

Chip on board (COB)
Fine pitch SMT
Flip chip
High bright (HB) LED assembly
High power (HP) LED assembly
Hybrid microcircuits
Laser diodes
Micro-Electrical-Mechanical systems (MEMs)
Micro-Optical-Electrical-Mechanical systems (MOEMs)
Microwave modules
Multi-chip modules (MCMs)
Optoelectronic modules
RF packages
Stacked die

Component placement applications include:

AuSi eutectic scrub
AuSn eutectic solder attach
PbSn solder preform
Anisotropic Conductive Paste (ACP) for flip chip attachment
High accuracy placement of optical components

Application Options

The Model 3500-III CPWC is an extremely versatile piece of equipment and can provide specialized functions in addition to its primary functions:

Flip Chip Assembly

The 3500-III CPWC can perform flip chip assembly for a large range of chip sizes and applications, including epoxy and eutectic die attach. It can perform flip, dip, and lookup camera alignment in any combination, in any sequence, and also out of sequence (such as for solder or epoxy applications that require an intermediate step, such as an epoxy dispense or daub).

Eutectic Die Assembly

Automatic eutectic attach techniques are particularly suited for high-performance and high-capacity die attach applications, such as hybrid components and high-power communication devices. Our high accuracy pulse heat stage has been specially designed for the Model 3500-III CPWC to allow controlled reflow, resulting in a stronger bond with no voiding. We can also implement a steady state heat stage if the application requires it, which is more typical for Au-Au interconnections or AuSi eutectic scrubbing applications.

Dispensing

A Palomar specialty is the ability to provide up to three channels of fluid dispense, particularly useful for a high mix of parts and processes. When your application requires epoxy die attach, several automated options are available:

Line dispensing—typically for larger devices where a pattern of dispense is needed; epoxy can be conductive or nonconductive; this type of dispenser (auger) requires a specified minimum epoxy viscosity
Dot dispensing—typically for high accuracy dispense of small dots as small as 15 mils on small devices; this type of dispenser (digital piston) requires a specified minimum epoxy viscosity
Time and pressure dispensing—less accurate and consistent than line or dot dispensing but may be necessary if the best application solution calls for an epoxy that does not meet the auger or digital piston viscosity requirements; typically used to dispense lines over a wide area with low viscosity epoxy

Daubing

When the volume of production does not warrant a digital piston dot dispenser, then daubing is a good alternative—the Model 3500 can accommodate one or more individually controlled daubing stations. The automated daub tool is dipped into the daub pot, which contains the epoxy, and then touched to the die surface, resulting in dot transfer. These transferred dots can be as small as 5-8 mils—in actuality, dots larger than 15 mils are difficult to obtain. Low volume requirements and small dot size are the primary reasons to use daubing.

Capability

The Model 3500-III CPWC offers:

8-position tool turret—for rapid tool changes on the fly
Automated eutectic die assembly—for high volume, high accuracy component placement
Bond Data Miner™ (BDM) and RAM statistics—provides part traceability, predictive process capability, and monitors machine fitness
Fully automated substrate and part loading—results in higher throughput and yields
Linear encoders—increased accuracy and throughput, accurate and repeatable bond placement
Very large work area (35”W x 20”D)—eliminates need to swap out between options, and accommodates both large and small microcircuit substrates and packages
Precision eutectic control—applies heat at the temperature and length of time required for the application

Equipment Options

Model 3500-III CPWC options include equipment for fully automatic substrate handling and special application requirements, such as:

Custom tooling—assures a perfect bond because each application is different
Die flip station—for flip chip assembly applications
Dispensers (single/dual/triple, auger, digital, time and pressure)—various pump technologies can be added to the system so that materials can be dispensed directly from the bonder as part of the overall assembly process
Hot rail and high capacity magazine handlers—improves yield and throughput, and reduces human-induced error
Modular and edged-belt conveyors—additional types of material handlers
Pulse/steady state heat stage—a feature unique to Palomar that provides the ability to apply precisely controlled heat to the application
Software—productivity enhancing tools, like offline programming, wafer mapping, look-up camera referencing, and post-placement accuracy check, can be added during build or as need arises
Tape and reel feeders—allows the bonder to pick die directly from the tape
Wafer punch up systems (single, dual, quad, motorized)—allows the bonder to pick die directly from the wafer
Waffle and gel-pack stages—an efficient way of presenting die to the bonder

Let Us Help You

We would be happy to evaluate your microelectronics assembly need and propose a solution. Please call us at (760) 931-3600 or send an email to info@bonders.com.