Epoxy Die Attach  

Process development for Laser Printhead Assembly

 

 

Application: Using both model 3500 and the 6500 to develop process for optical component attachment

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Requirements Specifications
Model 3500 Flexible Component Placement Cell Placement accuracy X, Y≤ ± 5µm at 3σ
Placement accuracy Z ≤ ± 10µm at 3σ
 Model 6500 Component Placement Work Cell Dot size = 11-13mil dot size
 Pick Tool = Die Collet Vespel  
 Daub Tool = Round Tip  
Epotek H20E silver filled epoxy  
   
   
   
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