THE MODEL 8000 BALL BUMPER
The planarBump™ feature on the Model 8000 Ball Bumper uses our patented advanced packaging technology to bond co-planar gold ball bumps onto a wafer or die in a single step process, making it an excellent interconnect media for flip chip applications. The fully automated planarBump™ system is an integrated solution that addresses the microelectronic industry’s growing need for higher package density, increased reliability, and increased signal performance, while providing a clean, environmentally safe alternative to lead-based processes with a solderless Au-Au interconnect solution. Learn more about the Model 8000 Ball Bumper with this PDF datasheet (188 kB). Download the Adobe PDF Reader free.
Applications
Products that require a shrink in geometry, and where ball bumping is the preferred method of die attach include:
- Cameras and camcorders
- Cell phones
- MEMs
- PDAs
- Sensors
- Stacked memory devices Internal components, such as DSPs, ASICs, SAW filters, high bright/high power LEDs, and CMOS image sensors, are gaining both space and performance benefits as they move to flip chip technologies.
Other typical applications include:
- Automotive assemblies
- Chip on board (COB)
- CMOS camera modules
- Disk drive assemblies
- Display & solar panels
- Fine pitch devices
- Flex circuits
- Large complex hybrids
- Multichip modules (MCMs)
- Specialty lead frames
- System in packages (SIPs)
planarBump™ Technology
The Palomar Technologies Model 8000 Ball Bumper is the only machine that can produce co-planarized gold bumps in one step. Using industry standard 15-46 micron gold wire in a process similar to wire bonding, planarBump™ creates planarized, tailless bumps in a consistent, repeatable, single-step process. This technology is based on our mature and proven wire bonding process, therefore the reliability of these bump connections is well established and understood. This feature is included in new Model 8000s and is available as an upgrade option on existing ones. Co-planarity refers to the height consistency across the top of all bumps. Height variations can lead to uneven distribution of forces, die fractures, and open circuits—planarBump™ offers industry-best finished bond height consistency of 2 microns (with bump placement accuracy of ± 2.5 microns) and also produces a consistent top surface area on each bump, leading to ideal connectivity and attachment for flip chip applications. The flexibility of planarBump™ allows for quick and easy changes to the ball bump array, position, and shape to best suit the application and desired attach process. The working platform accommodates small, batch, and high volume runs for all your R&D, prototyping, and manufacturing needs.
Benefits and Advantages
As the demand for lead-free interconnect solutions increases, gold bumping has become an excellent alternative to solder bumping. Gold bump connections offer a cleaner process and eliminate the need for under-bump metallization (UBM) and fluxing. Gold bumping also provides superior electrical connectivity, low inductance values, reduced electrical loss, and lower power requirements, making it attractive for those seeking to move away from gold wire bonding or solder interconnects. Gold bumping can be less expensive than solder bumps in many applications. The cost benefit of gold versus solder primarily depends on how many bumps are on each wafer—when using wire to make gold ball bumps, you only pay for the number of bumps placed, so if your application requires less than 140,000 bumps, then it’s more cost effective to use gold.
Let Us Help You
We would be happy to evaluate your packaging and component assembly needs and develop an interconnect solution. Please call us at (760) 931-3600 or send an email to info@bonders.com