Eutectic Die Attach  

AuSn Solder attach of Quartz Die to a Silicon Substrate

 

Application: Main requirements included placement accuracy, bond shear strength, and throughput.

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Requirements Specifications
Model 6500 Component Placement Work Cell Post-bond placement accuracy X,Y≤ ±2µm
Pulsed Heat Stage (PHS) Post-bond vertical alignment in Z ≤ 0.1µm
 Waffle pack/Gelpak presentation stage Throughput = 0.4min or 24s per bond
Pick Tool =  Die Collet rectangular       pyramid tungsten carbide Yield = 90 percent minimum
  Shear strength = 100gram minimum
  Lookup camera alignment
  Reflow temperature < 380ºC
   
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