Eutectic Die Attach

Eutectic Die Attach applications include AuSn Eutectic Attach, RF Power Modules, LED packaging, Active Optical Modules as well as many other device attachments in the optoelectronic packaging and high-power communication device arena.

Eutectic Die Attach

Eutectic Die Attach	AuSn Solder attach of Quartz Die to a Silicon Substrate Ex (Right): Eutectic Die Attach, chip placement and solder wetting Application: Main requirements included placement accuracy, bond shear strength, and throughput.

Requirements	Specifications
Model 6500 Component Placement Work Cell	Post-bond placement accuracy X,Y≤ ±2µm
Pulsed Heat Stage (PHS)	Post-bond vertical alignment in Z ≤ 0.1µm
Waffle pack/Gelpak presentation stage	Throughput = 0.4min or 24s per bond
Pick Tool = Die Collet rectangular pyramid tungsten carbide	Yield = 90 percent minimum
	Shear strength = 100gram minimum
	Lookup camera alignment
	Reflow temperature < 380ºC