 |
AuSn Solder attach of Quartz Die to a Silicon Substrate
Application: Main requirements included placement accuracy, bond shear strength, and throughput.
|
 |
| Requirements |
Specifications |
| Model 6500 Component Placement Work Cell |
Post-bond placement accuracy X,Y≤ ±2µm |
| Pulsed Heat Stage (PHS) |
Post-bond vertical alignment in Z ≤ 0.1µm |
| Waffle pack/Gelpak presentation stage |
Throughput = 0.4min or 24s per bond |
| Pick Tool = Die Collet rectangular pyramid tungsten carbide |
Yield = 90 percent minimum |
| |
Shear strength = 100gram minimum |
| |
Lookup camera alignment |
| |
Reflow temperature < 380ºC |
| |
|