PALOMAR TECHNOLOGIES PRODUCTS
Palomar Technologies is proud to offer a wide range of products and services that are sure to meet any packaging and assembly need. We specialize in customization, and the ability to use our equipment for multiple purposes, as standalones or integrated into a production line, makes our equipment and services an ideal solution to today’s demand for innovation and doing more with less.
Model 8000 Wire Bonder
The Model 8000 Wire Bonder is a fully automated thermosonic high speed ball-and-stitch wire bonder and is the assembly method of choice for first level interconnection. Key features include adaptive bond deformation, enhanced loop mode, tailless ball bumping, and wedge emulation (chain bonding). Learn more …
Model 8000 Ball Bumper
When ball bumping is the preferred method of die attach, such as for flip chip applications, the Model 8000 Ball Bumper is the ideal choice. This fully automated bonder uses our patented advanced packaging planarBump™ technology to create the first ever co-planar bumps in a single step process. The flexibility of planarBump™ allows for quick and easy changes to the ball bump array, position, and shape to best suit the application and desired attach process. Learn more …
Model 3500-III Component Placement Work Cell
The Model 3500-III Component Placement Work Cell is designed for fully automatic, precision microelectronics assembly and performs adhesive dispense, pick and place component placement, eutectic die attach, and flip chip operations. This versatile machine is well suited for a high mix, low volume production environment, and can easily be configured for high volume production by adding automated handling capabilities. Learn more …
Model 6500 Precision Component Placement Work Cell
The Model 6500 Precision Component Placement Work Cell is designed for high speed, fully automatic precision component assembly and offers micron-level placement accuracy for photonic, wireless, and medical applications. Learn more …
Model 2470-V Wedge Bonder
The Model 2470-V Wedge Bonder performs low-profile (fine pitch) interconnects and is also well suited for running stitch interconnects, reverse bonding, and ribbon bonding. It performs high speed, fine pitch automatic gold and aluminum wedge bonding, and gold ribbon bonding. Learn more …
Model 3470-II Wedge Bonder
The Model 3470-II Wedge Bonder performs low-profile (fine pitch) interconnects and is also well suited for running stitch interconnects, reverse bonding, and ribbon bonding. It has the largest available bonding envelope and offers exceptional control and repeatability for challenging and complex applications. Learn more …
Integrated Production Line Services
We use our manual and automated process flow expertise to offer complete solutions to your assembly need, including full program management, systems integration, and automation. Learn more …
Palomar Microelectronics
Our experience with design, engineering, prototyping, assembly, automation, and metrology means that we can take you from concept to production, and beyond. We apply ideas and solutions based on years of packaging experience to develop and validate your process before you invest in production equipment. And if you don’t want to run your own production, we can do that for you too by offering turnkey services for advanced packaging assembly. Learn more …