Contract Manufacturing and Assembly - Capabilities

Palomar MicroElectronic engineers have extensive experience with design, engineering, protoyping, assembly, automation, and metrology.  This enables customers to go from Concept to Production, and further customize the process to meet customers' needs. 

By applying ideas and solutions based on decades of packaging and assembly experience, Palomar MircoElectronics helps customers develop and validate their process before investing in production equipment.

Automating Process Flow with ADMA®

Palomar MicroElectronics' labororatory conducts all its applications and processes with the in-house developed software Automated Data Management Analaysis. ADMA is Palomar's paperless factory software system that documents activities in the lab. These documents inlcude: 1) assemblies via Work Order Flow Tags (WOFT), 2) product inventory, and 3) general lab supplies while capturing all material transactions. Controlling and tracing bonding applications improves efficiency in the lab. Due to the automated nature of the software and its sophisticated ability to track single sites of large wafers, for example, the feedback loop is tighter between problems and their solutions. Using the wafer example, if a particular site is bad, ADMA immediately picks this up - the laboratory then readjusts the process and makes neccessary changes. Without this ability, many man-hours are wasted by working backwards to find what site on the wafer was problematic. The paperless aspect of the software is key: a lab needs a high level of cleanliness. ADMA removes the human factor not only with its cleaniness but also by reducing the occurance of routine operator, technician and engineer error.

Every Contract Assembly customer benefits from the implementation of ADMA.

Process Development and Prototyping Services

Ball Bumping

customized die bonding applications

Component Placement

Metrology

Package Design and Analysis

Package Sealing

Pilot Builds

SMT 

Wire Bonding

 

Advanced Packaging and Assembly Services

Wafer Scale Packaging

Gold Ball (Stud) Bumping

Advanced Wire Bonding

Eutectic Component Bonding

Eutectic Die Attach

Very High Precision Component Placement (<5 microns)

Laser Diode Packaging

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