Contract Manufacturing and Assembly - Capabilities

Palomar MicroElectronic engineers have extensive experience with design, engineering, protoyping, assembly, automation, and metrology.  This enables customers to go from Concept to Production, and further customize the process to meet customers' needs. 

By applying ideas and solutions based on decades of packaging and assembly experience, Palomar MircoElectronics helps customers develop and validate their process before investing in production equipment.

Automating Process Flow

Palomar MicroElectronics works hand in hand with Integrated Production Line Services (IPLS) to provide a complete solution to your process flow need. While MicroElectronic's engineers provide a process "recipe" and prototyping expertise, IPLS provides manual and automated process flow expertise. IPLS enables the customer to implement their own production.

Process Development and Prototyping Services

Ball Bumping

Component Placement

Metrology

Package Design and Analysis

Package Sealing

Pilot Builds

SMT 

Wire Bonding

 

Advanced Packaging and Assembly Services

Wafer Scale Packaging

Gold Ball (Stud) Bumping

Advanced Wire Bonding

Eutectic Component Bonding

Eutectic Die Attach

Very High Precision Component Placement (<5 microns)

Laser Diode Packaging