| Bring your flexible, high precision Palomar Model 3500 Die Bonder up to the latest –III revision enabling these features and benefits |
| Features |
Benefits |
| PTI’s latest bonder software and Windows XP operating system installed on a P4 PC |
Offers continued product support |
| Bright, high resolution 19” LCD monitors |
Improves the ergonomics of the system |
| Cognex 8000 Vision system |
Faster, more accurate pattern recognition |
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In addition to the above listed features and benefits, this upgrade allows you to add the following productivity enhancing options
| 1. Pulsed Heat Stage |
Superior control for eutectic bonding |
| 2. Off Line Programming |
Less down time required for new program setup; increases the productivity in a high mix, low volume production environment |
| 3. Motorized Wafer Punch Ups |
Accurately lifts thin and/or odd aspect ratio die from the wafer |
| 4. Digital Dispensing |
Very precise dispensing of low volume applications |
| 5. Automated Handling |
Palomar offers various handling systems built to support each application best |
Contact your local representative for additional information.