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| Sunday, May 11, 2008 |
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Automated Hybrid Assembly Comes of Age
By Laurie @ 11:43 PM :: 146 Views
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With the increased levels of complexity and spiraling costs in manufacturing, hybrid and MCM manufacturers are increasingly turning to the use of automated assembly lines to integrate several of the component placement, wire bonding and accessory steps.
The resultant improvements in yields, increased throughput, and reduced time to market have made automated assembly lines among the most strategic competitive weapons for reduction of total cost of ownership in the coming decade.
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| Tuesday, December 11, 2007 |
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Palomar Technologies Partners with Vision Manufacturing, Inc. to add PWB and SMT Services for Palomar Microelectronics
By Laurie @ 12:07 AM :: 176 Views
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Carlsbad, Calif. – December 11, 2007 – Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronics, announces a partnership with Vision Manufacturing, Inc. (VMI), of Vista, California. Through VMI, Palomar Microelectronics can offer printed wiring board (PWB) and surface mount technology (SMT) services for its customers to supplement the process development, prototyping, and low volume assembly services Palomar Microelectronics provides.
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| Thursday, November 15, 2007 |
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Palomar Technologies Presents Two Papers at IMAPS: ”High Brightness LED Packaging” and “Gold to Gold Flip Chip Interconnect”
By Laurie @ 11:51 PM :: 101 Views
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Carlsbad, Calif. – October, 2007 – Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronic assembly, will present High Brightness Matrix LED Assembly Challenges and Solutions by Daniel D. Evans, Jr., Palomar’s senior scientist. Philip Couts, TDK Corporation of America, will present Gold Stud Bumping for High Density Flip Chip Interconnect, co-authored by Mr. Evans. The IMAPS symposium will be held November 11 to 15, 2007 in San Jose, California.
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| Saturday, September 01, 2007 |
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Palomar Technologies Features High Throughput Automated Gold Bumping at SEMICON Taiwan 2007
By Laurie @ 12:04 AM :: 116 Views
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Carlsbad, Calif. – September 12, 2007 – Palomar Technologies, provider of precision automation equipment, and process development and assembly services for microelectronic assembly, will feature its Model 8000 for high throughput automated gold ball bumping at SEMICON Taiwan, in hall 1 booth number 190, from
September 12-14, 2007.
The model 8000 represents the latest advances in goldball bumpers, incorporating leading-edge mechanical design, control architecture, and graphical user interfacto provide the highest net throughput and flexibility of any comparable tool on the market today.
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| Friday, August 24, 2007 |
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LED Packaging Services and Equipment From Palomar Technologies
By Laurie @ 11:58 PM :: 102 Views
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Carlsbad, Calif. – August 24, 2007 – Palomar Microelectronics, the assembly and test division of Palomar Technologies, Inc., offers process development and assembly services including advanced wire bonding, gold ball bumping, and direct-chip-attach of eutectic and epoxy bonded high-power LEDs, MEMS devices, microwave & RF components, optoelectronic packages, multi-chip modules, and hybrids. Palomar Microelectronics operates from Palomar Technologies’ headquarters in Carlsbad, California. Services include process development, prototyping, volume assembly and test.
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2728 Loker Ave West
Carlsbad, CA, 92010
info@bonders.com
760.931.3600
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