Technology Breakthroughs
Awards & System Debuts - Timeline
Late 1990s
- Debut of the CBT 6000 Automatic Gold Wire Bonder, winner of the 1999 Semiconductor International Editor's Choice Best Product Award
Early 2000s
- Debut of the Model 6500 Precision Eutectic Die Bonder, winner of the 2003 Advanced Packaging Award (Die Placement and Attach) and the 2004 Most Innovative New Product Award from UCSD Connect (General Technology)
- Debut of the Model 8000 Wire Bonder, winner of the 2004 Advanced Packaging Award at SEMICON West and the 2005 Global Technology Award at Productronica (Munich)
- Debut of the Model 8000 Ball Bumper, a variation of the Model 8000 Wire Bonder and winner of the 2005 Semiconductor International Editor's Choice Best Product Award
Mid 2000s
- The Model 3500-II Automatic Component Placement Cell receives the 2006 Semiconductor International Editor's Choice Best Product Award
- Debut of the Model 3500-III Automatic Component Placement Cell
- Debut of the Model 3470-II Wedge Bonder
Late 2000’s
- Debut of the Model 3500-III Automated Component Placement System
- Debut of Model 2100 C Laser Interferometer
- Debut of the Model 6500 Wafer Scale Packaging Eutectic Die Bonder
Innovating Technologies and Developing Patents:
Late 1990s
- Measuring Electrical Interconnect Integrity
- Ultrasonic Wire Bonder and Transducer Improvements
Early 2000s
- Wire Conveyance with Contactless Slacking
- Dual Axis Bond Head
- Tailless Ball Bump
Mid 2000s
- High Accuracy Placement with Double Pick and Place
- Positioning Optical Fibers
Late 2000s
- Successfully bonds Platinum wire
Trademarked Technologies:
- Adaptive Bond Deformation™(ABD)—for ultimate control over ball and stitch deformation
- Bond Data Miner™(BDM)—a software feature that provides part traceability, predictive process capability, and monitors machine fitness
- Digital Dispensing™—very precise dispensing for low volume applications
- Enhanced Loop Mode™(ELM)—provides exceptional long, low loop capability, with loops up to 10mm
- planarBump™—an advanced packaging option on the Model 8000 Wire Bonder & Ball Bumper that uses gold wire to produce tailless ball bumps
|
|
|
|