About Us

ABOUT PALOMAR TECHNOLOGIES

Palomar Technologies is headquartered in Carlsbad, CA, with three national sales offices that service North, South, and Central America. Our headquarters is our primary engineering, production, and manufacturing facility.

From our office in Erlangen, Germany and Singapore, we provide sales, service and applications demonstration support for our European and Asian customers.

Some Background History

Palomar Technologies was originally established in the 1970s within the Assembly and Test Products product line of Hughes Aircraft Industrial Products Division (IPD) (which became known as the Technology Products Division (TPD) in the early 1990s). As the Automatic Microcircuit Bonder group, we primarily served Hughes’ military and aerospace customers by developing industrial electronics.

Our major accomplishments during this period include:

Early 1980s—debut of the Model 2470-I Wedge Bonder, the most innovative product of its kind on the market and a key to the defense industry; the Model 2470-V Wedge Bonder debuted in 1995
Late 1980s—leading the way for the development of supercomputers
Early 1990s—leading the way for die attach technology with the debut of the Model 3500-I

Automatic Component Placement Cell; the development of integrated production lines; and the debut of the Model 3470-I Wedge Bonder

We developed many patents during our years as the Automatic Microcircuit Bonder group, 19 of which were transferred to our ownership as Palomar Technologies, including:

Ball Formation on Gold Wire
Missing Wire Detector
Bond Signature Analyzer
Orthogonal Bonding
Measuring Electrical Interconnect Integrity

In the late 1990s we were well positioned to take advantage of the telecom boom and have always maintained a diversified mix of products and customers, all with the common thread of precision automated packaging.

Who We Are Today

In 1995 our product group became Palomar Technologies, Inc., through a management led leveraged buy-out. We have built on our foundation as a defense-based, engineering-driven enterprise to become a premier provider of high-reliability solutions for complex electronic assembly applications. We are a leading supplier of award-winning automated high-precision assembly systems that increase yield and reduce costs for manufacturers of LED, optoelectronic, solar, RF, and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, medical, and life sciences industries. And we have expanded into providing micro assembly services, and advanced packaging turnkey production services.

Today, we continue to focus on anticipating and meeting our customer’s needs. Our honors and awards are a testament to the quality of our equipment and services, and to our customer’s satisfaction:

Late 1990s

Debut of the CBT 6000 Automatic Gold Wire Bonder, winner of the 1999 Semiconductor International Editor's Choice Best Product Award

Early 2000s

Debut of the Model 6500 Precision Eutectic Die Bonder, winner of the 2003 Advanced Packaging Award (Die Placement and Attach) and the 2004 Most Innovative New Product Award from UCSD Connect (General Technology)
Debut of the Model 8000 Wire Bonder, winner of the 2004 Advanced Packaging Award at SEMICON West and the 2005 Global Technology Award at Productronica (Munich)
Debut of the Model 8000 Ball Bumper, a variation of the Model 8000 Wire Bonder and winner of the 2005 Semiconductor International Editor's Choice Best Product Award

Mid 2000s

The Model 3500-II Automatic Component Placement Cell receives the 2006 Semiconductor International Editor's Choice Best Product Award
Debut of the Model 3500-III Automatic Component Placement Cell
Debut of the Model 3470-II Wedge Bonder

And we haven’t stopped innovating and continue to develop patents, including:

Late 1990s

Measuring Electrical Interconnect Integrity
Ultrasonic Wire Bonder and Transducer Improvements

Early 2000s

Wire Conveyance with Contactless Slacking
Dual Axis Bond Head
Tailless Ball Bump

Mid 2000s

High Accuracy Placement with Double Pick and Place
Positioning Optical Fibers

We also have several trademarked technologies, including:

Adaptive Bond Deformation™(ABD)—for ultimate control over ball and stitch deformation
Bond Data Miner™(BDM)—a software feature that provides part traceability, predictive process capability, and monitors machine fitness
Digital Dispensing™—very precise dispensing for low volume applications
Enhanced Loop Mode™(ELM)—provides exceptional long, low loop capability, with loops up to 10mm
planarBump™—an advanced packaging option on the Model 8000 Wire Bonder & Ball Bumper that uses gold wire to produce tailless ball bumps

LOWERING THE COST OF PRECISION

Palomar Technologies offers a wide range of products and services that are sure to meet any packaging and assembly need. Our fully automated products assist component manufacturers in the wireless, photonic, microwave, photovoltaic, computer, automotive, aerospace, and medical industries with improving production quality and yield, shortening assembly times, and increasing profits. We offer custom integration of multiple machines and processes into a complete automated assembly line, delivering a simpler, more powerful solution that is easier to install, maintain, and operate. For you, our customer, this means higher yields, greater productivity, less downtime, and faster time to market. Our experience with design, engineering, prototyping, assembly, automation, and metrology means that we can take you from concept up to, and into, production. We can help you demonstrate the viability of new products by developing prototypes with the equipment and processes needed for high volume manufacture. Our ability to offer high-value-added assembly services to our advanced packaging customers is one facet of our mission to provide cost effective, and system efficient, solutions for your component assembly needs.

Let Us Help You

We would be happy to evaluate your product application need and develop an interconnect solution. Please call us at (760) 931-3600 or send an email to info@bonders.com.