Benefits of System-on-a-Chip include:
- Smaller footprint and space requirements
- Higher performance due to increased amount of circuits on the chip
- Greater system reliability
- Can translate into lower cost for the end user
- Lower power requirements
Applications for System-on-a-Chip include:
- Digital Signal Processors
- Embedded Systems
- Video Decoders
- Mobile Phones
- Cable and Satellite TV Set Top Boxes
- Portable Media Devices
Some may argue that in high volumes, System-on-a-Chip is be more cost effective than System-in-a-Package since it increases the yield of the fabrication and because its packaging is simpler. But this can’t be overshadowed by the challenges that System-on-a-Chip can pose: 1) potential lower IC yields and greater fabrication cost due to the larger die sizes; 2) usually greater prototyping and design cycle time (high NRE); and 3) larger design space often required. Ultimately, it is your specific need that will determine what is best.
Palomar’s Solution
The Model 8000 Wire Bonder System is a customer favorite for performing System-on-a-Chip applications. The Model 8000 Stud Bumper System configuration can also be used to perform this function.
Palomar Microelectronics contract assembly services clean room space, assembly systems, technical know-how and broad experience can take you from concept to production on any System-on-a-Chip application. Palomar engineers will rapidly derive processes and overcome your challenges and problems, thus getting your application running in a short time.