Optoelectronic Packaging
Today, the optoelectronic market falls under two categories: Telecommunications & Consumer. Palomar Technologies provides solutions in both categories and serves customers worldwide with a variety of applications.
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Putting the Optoelectronic Package Together
The packaging process for an optoelectronic device has challenged efforts to reduce cost. Because the purpose of an optical component is to manipulate light, the design rules for packaging are significantly more complex than those found in the semiconductor industry.
With semiconductors, advances in wafer processing drive technology, and packaging is very automated and planar. With optical components, the front-end process is significantly more complex. Equally important for optoelectronic devices are package design, controlled assembly processes and meeting critical assembly alignment and position tolerances.
Optoelectronic packaging requires the following packaging system capabilities:
- Process - requires a system that is highly controlled in every facet
- Purity – no contamination to occlude optical surfaces
- Heat Transfer – eutectic processes are required
- Precision – component alignment is critical for optimal optical performance
If you are looking for an optoelectronic packaging system, you are in the right place. Palomar bonders were developed before optoelectronics became big business. Consumers are now dependent internet connectivity being available everywhere, thereby making optoelectronics a key element in the growth of the internet.
Continuing the Hughes Aircraft legacy, built over the last several decades, Palomar manufactures and services highly advanced microelectronic packaging systems, excelling in advanced processes, high purity, exceptional heat transfer and precision. Palomar’s Systems & Contract Assembly Solutions are a perfect fit for Optoelectronic Packaging.
Palomar solves the most exacting and diverse optoelectronic packaging challenges rapidly and cost effectively. We do this by providing a unique combination of custom-designed bonders, superior process development, quick-turn contract manufacturing and a global service infrastructure. This minimizes our customer’s project risk and accelerates their time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring them a strong and sustainable competitive advantage.