Laser Diode Packaging

Laser Diode Packaging can be a unique challenge for a company. Often times, to achieve an optimal packaging process, a system that is flexible and can handle a high range of product mix with high accuracy (+/- 2 mil), precision (Less Than 5 microns, 3 sigma) and a high thermal transfer process is necessary.

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Palomar Solutions

  • High Yield, Volume Laser Diode Assembly
  • Reduction of setup costs
  • Rapid Prototyping/Quick Turn Projects

When it comes to the high thermal transfer process, it is imperative to have a controlled process where the system can ensure your devices to be assembled at an exceptionally high yield. A very good laser diode package can only be accomplished using a pulse heat or a eutectic process. To generate stable light emission, it’s critical to achieve a void-free eutectic solder interface between the components and the package. Visit "Eutectic Process in LED Assembly" blog article for more information on this complex topic.

 


Laser Diode Packaging Challenges & Solutions

Yield
Challenges Solutions
Very accurate placement Pulsed heat eutectic process
Void free eutectic interface Tightly coupled temperature feedback
Extremely accurate temperature control Extreme temperature control
High temperature ramp rates (C’/sec) True perpendicular placement force during reflow
Controlled cool down profile High power pump lasers
  P-side Up / Down Source Lasers
  VCSEL Arrays
Throughput
Challenges Solutions
High temperature ramp rates Over 80’C/sec temperature ramp w/preheated cover gas
High speed, high accuracy component placement High cyclical placement rate w/5 micron, 3 sigma placement accuracy
Sufficient presentation tooling Over 700 sq in of work space
Eliminate human handling components Runs independently
 
Time To Volume

Challenges Solutions
Deliveries that enable fast production ramping Taking orders today w/short delivery times
Process characterization Advanced applications expertise derived from extensive characterization
Advanced training Complete, process-specific training
Total solution Fully automatic In-Line LDA Assembly Solutions
Cost
Challenges Solutions
Cost to Automate? 4-5 semi-automatic stations replaced<
Cost not to Automate? Greater than 50% Yield Improvement Reported
Flexibility  
Time to Volume  
Yield  
Clean room space
Challenges Solutions
Semi-automatic systems require large facilities footprint 4-5 semi-automatic stations replaced
Semi-automatic solutions require many systems for Volume Laser Diode Attach can run unattended
  High yield reduces number of assembly cells required for volume
  Flexible solution – replacing many unique assembly tools


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