Laser Diode Packaging Challenges & Solutions
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| Yield |
| Challenges |
Solutions |
| Very accurate placement |
Pulsed heat eutectic process |
| Void free eutectic interface |
Tightly coupled temperature feedback |
| Extremely accurate temperature control |
Extreme temperature control |
| High temperature ramp rates (C’/sec) |
True perpendicular placement force during reflow |
| Controlled cool down profile |
High power pump lasers |
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P-side Up / Down Source Lasers |
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VCSEL Arrays |
| Throughput |
| Challenges |
Solutions |
| High temperature ramp rates |
Over 80’C/sec temperature ramp w/preheated cover gas |
| High speed, high accuracy component placement |
High cyclical placement rate w/5 micron, 3 sigma placement accuracy |
| Sufficient presentation tooling |
Over 700 sq in of work space |
| Eliminate human handling components |
Runs independently |
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| Time To Volume |
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| Challenges |
Solutions |
| Deliveries that enable fast production ramping |
Taking orders today w/short delivery times |
| Process characterization |
Advanced applications expertise derived from extensive characterization |
| Advanced training |
Complete, process-specific training |
| Total solution |
Fully automatic In-Line LDA Assembly Solutions |
| Cost |
| Challenges |
Solutions |
| Cost to Automate? |
4-5 semi-automatic stations replaced< |
| Cost not to Automate? |
Greater than 50% Yield Improvement Reported |
| Flexibility |
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| Time to Volume |
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| Yield |
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| Clean room space |
| Challenges |
Solutions |
| Semi-automatic systems require large facilities footprint |
4-5 semi-automatic stations replaced |
| Semi-automatic solutions require many systems for Volume |
Laser Diode Attach can run unattended |
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High yield reduces number of assembly cells required for volume |
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Flexible solution – replacing many unique assembly tools |