Flip Chip | Feasibility of Anisotropic Conductive Paste (ACP) as Interconnect Material on RFID Flip Chip Application Application: Die attach of an RFID flip chip on flex application using anisotropic conductive paste (ACP). |
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| Requirements | Specifications |
| Model 3500 Flexible Component Placement Cell | Snap cure of ACP in-situ with programmable heat, force and time |
| Daubing station | Placement accuracy of ±12.7µm (0.5mil) |
| Pick Tool = Die Collet Vespel | 130% to 150% die area coverage |
| Daub Tool = Round Tip | Yield of 90% |
| Hot tip option | |
| Standard Gelpak Presentation Stage | |
| Custom presentation plate | |
| Loctite NCP 3447 | |