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Component Systems

Automated Component Systems are geared to perfrom ultra high accuracy eutectic die attach, pick and place, and flip chips for applications such as Complex Hybrid Modules, Opotelectronics Modules, RF Packages, MCMs, Laser Diode Packaging, LED Packaging (High-Bright and High-Power), Stacked Die, VCSEL Modules and MEMs (Micro-Electrical-Mechanical components).

The Model 3500-III Component Placement Work Cell is designed for fully automatic microelectronic assembly with 5-13μm placement accuracy, depending on the application.

The Model 6500 Precision Eutectic Component Placement Work Cell offers ultra high precision component assembly with up to 1.5um placement accuracy.

Eutectic Die Attach | Flip Chip | Epoxy Die Attach | Pick and Place

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