 | AuSn Solder attach of Quartz Die to a Silicon Substrate Application: Main requirements included placement accuracy, bond shear strength, and throughput. |
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| Requirements | Specifications |
| Model 6500 Component Placement Work Cell | Post-bond placement accuracy X,Y≤ ±2µm |
| Pulsed Heat Stage (PHS) | Post-bond vertical alignment in Z ≤ 0.1µm |
| Waffle pack/Gelpak presentation stage | Throughput = 0.4min or 24s per bond |
| Pick Tool = Die Collet rectangular pyramid tungsten carbide | Yield = 90 percent minimum |
| | Shear strength = 100gram minimum |
| | Lookup camera alignment |
| | Reflow temperature < 380ºC |
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