Microelectronics,Advanced Microelectronics Technologies

Applications - Ball Bump

	Tailless Ball Bumping Application: This ball bump application is a Palomar Technologies Inc. exclusive. The ball bumps are consistent and extremely versatile, found in a wide variety of parts and components. Ball bumping a wafer, single die or a substrate in a deep package for a flip chip process are all common. Bump shape height and diameter can be controlled from 15 um tall to 300 + um tall in stack, as well as 35 um to 180 + um in diameter.

Requirements	Specifications
Model 8000 Wire Bonder	Wire = 1 mil (25.4 um) 99.99 Au
Tailless Bump mode (Software option)	Temperature = 150 C
	Picture Magnification = x1.2K
	Ball Diameter = 80 um
	Ball height = 40 um
	Shear strength = not tested

	Tailless Ball Bump (MBD and MBH) Application: This ball bump application is a Palomar Technologies exclusive. The ball bumps are consistent and extremely versatile, found in a wide variety of parts and components. Ball bumping a wafer, single die or a substrate in a deep package for a flip chip process are all common applications. The application of this bump requires control of MBD and MBH. Top height is not critical.

Requirements	Specifications
Model 8000 Wire Bonder	Wire = 1 mil (25.4 um) 99.99 Au
Tailless Bump mode	Substrate = Al pad
	Temperature = 150 C
	Mashed Ball Diameter = 115 um
	Mashed Ball Height = 45 um
	Throughput 10-12 BPS