Ball Bumps and Tailess Ball Bumps

The ball bump show below is a Palomar Technologies exclusive.

The Ball Bumping is a method use to complete a conductive bond between a die and a substrate or a die and a die. A Wire Bonding System configured for Ball Bumping perform the application. Ball Bumping applications include MCMs, Specialty lead frames, large complex hybrids, System in packages (SiP), stacked memory devices. Palomar has developed a trademarked planarBump technology that co-planarized gold bumps in one step. This can only be accomplished using Palomar's Model 8000 Ball Bumper.

Applications - Ball Bump

	Tailless Ball Bumping Application: This ball bump application is a Palomar Technologies Inc. exclusive. The ball bumps are consistent and extremely versatile, found in a wide variety of parts and components. Ball bumping a wafer, single die or a substrate in a deep package for a flip chip process are all common. Bump shape height and diameter can be controlled from 15 um tall to 300 + um tall in stack, as well as 35 um to 180 + um in diameter.

Requirements	Specifications
Model 8000 Wire Bonder	Wire = 1 mil (25.4 um) 99.99 Au
Tailless Bump mode (Software option)	Temperature = 150 C
	Picture Magnification = x1.2K
	Ball Diameter = 80 um
	Ball height = 40 um
	Shear strength = not tested

	Tailless Ball Bump (MBD and MBH) Application: This ball bump application is a Palomar Technologies exclusive. The ball bumps are consistent and extremely versatile, found in a wide variety of parts and components. Ball bumping a wafer, single die or a substrate in a deep package for a flip chip process are all common applications. The application of this bump requires control of MBD and MBH. Top height is not critical.

Requirements	Specifications
Model 8000 Wire Bonder	Wire = 1 mil (25.4 um) 99.99 Au
Tailless Bump mode	Substrate = Al pad
	Temperature = 150 C
	Mashed Ball Diameter = 115 um
	Mashed Ball Height = 45 um
	Throughput 10-12 BPS