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Tailless Ball Bump (MBD and MBH)
Application: This ball bump application is a Palomar Technologies exclusive. The ball bumps are consistent and extremely versatile, found in a wide variety of parts and components. Ball bumping a wafer, single die or a substrate in a deep package for a flip chip process are all common applications.
The application of this bump requires control of MBD and MBH. Top height is not critical.
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