Applications

Ball (Stud) Bumping
The Model 8000 Ball Bumper produces consistent co-planar gold ball bumps in a single step process that can be bonded onto a wafer, die, or substrate. Bump shape, height, diameter, and array can be controlled.

Wire Bonding
The Model 8000 Wire Bonder is the assembly method of choice for high speed, high accuracy first level interconnection. It’s suitable for many aspects of packaging and component assembly, including fine pitch/high wire count applications.

Fine Pitch

	Fine Pitch Au Wire Bonding Application: Fine pitch wire bonding for bonding high density die is measured in pitch. This is a pitch that every year gets a little smaller. The limiting factor on the Palomar Model 8000 is generally the capillary. The model 8000 can bond with as little as 4 grams of force! This high resolution control of bond parameters is what makes fine pitch wire bonding smaller each year. The SEM photo shows wires bonded at 50 um pitch and the ball is only 30 um.

Requirements	Specifications
Model 8000 Wire Bonder	Wire = .6 mil (15 um) 99.99 Au
	Capillary = GAISER 1800 UFAB series
	Temperature = 150 C
	Picture Magnification = x600
	Ball Diameter = 30 um
	Ball height = not measured
	Shear strength = not tested
	Pitch = 50 um

Ribbon Bonding

Typical Wire Bonding

Wedge Bonding
We have a range of equipment that can perform wedge bonding. The Model 2470-V Wedge Bonder and the Model 3470-II Wedge Bonder both offer gold and aluminum low profile/fine pitch interconnects, stitch interconnects, reverse bonding, and ribbon bonding—the primary difference between them is the size of the work stage. The Model 8000 Wire Bonder can perform wedge emulation using gold wire.

Eutectic Die Bonding
Automatic eutectic attach techniques are particularly suited for high-performance and high-capacity die attach applications. Both the Model 3500-III Component Placement Work Cell and the Model 6500 Precision Eutectic Die Bonder perform eutectic die bonding with pulse heat stages that have been specially designed for each. Our unique pulse heat feature offers.

Epoxy Dispensing and Die Bonding
The Model 3500-III Component Placement Work Cell features up to four channels of fluid dispense, which is particularly useful for a high mix of parts and processes. The Model 6500 Component Placement Work Cell can perform Epoxy Die Bonding using 3rd party epoxy dispense.

Flip Chip Assembly
The Model 3500-III Component Placement Work Cell and Model 6500 Component Placement Work Cell both offer flip chip capability.

Component Placement
The Model 3500-III Component Placement Work Cell is designed for fully automatic microelectronic assembly with 5-13μm placement accuracy, depending on the application. The Model 6500 Precision Eutectic Component Placement Work Cell offers ultra high precision component assembly with up to 1.5um placement accuracy.